Lumped dynamic electrothermal model of IGBT module of inverters

Christophe Batard (1) , Nicolas Ginot (1) , Joe Antonios (2)

1 IETR - Institut d'Électronique et des Technologies du numéRique
2 SERMA INGENIERIE

This paper presents a lumped dynamic electrothermal model of IGBT-module of inverters. The thermal model consists of a three-dimensional network of RC cells constructed for time-dependent operation with a load current frequency ranging from 0.1 Hz to 100 Hz. The network was found to be precise to determine the temperature excursion of diodes and transistors subsequent to time-dependent power losses. Thermal resistances and capacitances accounting for heat spreading and thermal penetration depth effects were introduced. Electrothermal simulations carried out on a 1200 V-300 A module with a time-dependent average power loss were found in good agreement with experiments using infrared thermal imaging.

Mots clés: heat transfer; multiscale problem; Electrical-thermal co-simulation; semiconductor devices; thermal models

Domaines: Electronique

Christophe Batard, Nicolas Ginot, Joe Antonios. Lumped dynamic electrothermal model of IGBT module of inverters. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015, 5 (3), pp.355-364. ⟨10.1109/TCPMT.2015.2392625⟩. ⟨hal-01099737⟩