Organometallic polyphosphorus and -arsenic ligands as linkers between pre-assembled linear CuI fragments

Martin Fleischmann; Luis Dütsch; Mehdi Elsayed Moussa; Andrea Schindler; Gábor Balázs; Christophe Lescop; Manfred Scheer

doi:10.1039/C4CC09845E

Journal articles

Organometallic polyphosphorus and -arsenic ligands as linkers between pre-assembled linear CuI fragments

Martin Fleischmann ¹ Luis Dütsch ¹ Mehdi Elsayed Moussa ² Andrea Schindler ¹ Gábor Balázs ¹ Christophe Lescop ² Manfred Scheer ¹

1 Institut für Anorganische Chemie

2 ISCR - Institut des Sciences Chimiques de Rennes

Document type :

Journal articles

Domain :

Chemical Sciences

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https://hal-univ-rennes1.archives-ouvertes.fr/hal-01131140
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Submitted on : Friday, March 13, 2015 - 8:47:30 AM
Last modification on : Friday, December 10, 2021 - 3:52:08 PM

Organometallic polyphosphorus and -arsenic ligands as linkers between pre-assembled linear CuI fragments

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Organometallic polyphosphorus and -arsenic ligands as linkers between pre-assembled linear CuI fragments

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