Copper electroplating into deep microvias for the “SiP” application - Université de Rennes Accéder directement au contenu
Article Dans Une Revue Microelectronic Engineering Année : 2010

Copper electroplating into deep microvias for the “SiP” application

Résumé

In order to anticipate the further demands of miniaturization and integration of ‘‘System-in-Package”, the technology of 3D through-silicon-vias (TSVs) has been developed at NXP Semiconductors. The sputtering and the electroplating have been chosen for realize respectively a copper seed layer and a thick copper deposition inside 75 lm wide and hundreds micrometer deep microvias. The microvias, for an aspect- ratio (AR) up to 2.3, can be successfully covered by a sputtered 3 lm thick copper layer. To achieve a thick microvia filling, the pulsed current is preferred and a perpendicular electrolyte flow is critical. With an 11 lm thick patterned photoresist mask on the field, the 75 lm diameter and 180 lm deep microvias can be more-than-the-half filled using the ‘‘superfilling” recipe when the field depositing layer reaches the mask level. Such partially filled microvias exhibit excellent electrical resistances within the range of 4 mX.

Dates et versions

hal-01166220 , version 1 (22-06-2015)

Identifiants

Citer

Cheng Fang, Alain Le Corre, Dominique Yon. Copper electroplating into deep microvias for the “SiP” application. Microelectronic Engineering, 2010, The 2010 International workshop on “Materials for Advanced Metallization” - MAM 2010, 88 (5), pp.749-753. ⟨10.1016/j.mee.2010.07.034⟩. ⟨hal-01166220⟩

Relations

41 Consultations
0 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More