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Conference papers
Silicon: A flexible material for bendable electronics and sensors
Abstract : Directly crystallized deposited silicon at low temperature is shown to be the right material when bendable system including treatment electronics and sensing functions is needed. This is true particularly when process reproducibility, electrical and mechanical reliability of the devices are the most important parameters implying the success of the technology. Indeed, these parameters are the main issues when we need to go beyond the publication of a paper, towards actual commercial application. Electrical and mechanical performances of microcrystalline silicon thin film transistors and deformation sensors on 25 μm thick flexible plastics under high bending, still 0.75 mm curvature radius, are presented. These devices are fabricated directly on this substrate at a maximum temperature of 180°C. © 2016 IEEE.
Keywords :
Deformation
Flexible electronics
Microelectronics
Silicon
Students
Temperature
Thin film transistors
Commercial applications
Flexible materials
Flexible plastics
Maximum temperature
Mechanical performance
Mechanical reliability
Microcrystalline silicon thin films
Reproducibilities
Microcrystalline silicon
https://hal-univ-rennes1.archives-ouvertes.fr/hal-01484551
Contributor : Laurent Jonchère Connect in order to contact the contributor
Submitted on : Tuesday, March 7, 2017 - 1:22:37 PM
Last modification on : Wednesday, November 3, 2021 - 9:53:49 AM
Contributor : Laurent Jonchère Connect in order to contact the contributor
Submitted on : Tuesday, March 7, 2017 - 1:22:37 PM
Last modification on : Wednesday, November 3, 2021 - 9:53:49 AM