Delay-Extraction-Based Waveform Relaxation Algorithm for Fast Transient Analysis of Power Distribution Networks, IEEE Trans. Comp. Packag. Manuf. Tech, vol.2, issue.12, pp.2040-2056, 2012. ,
Power integrity Modeling and Design for Semiconductor and Systems, 2007. ,
Analysis and suppression of SSN noise coupling between Power/Ground plane cavities through cutouts in multilayer packages and PCBs, IEEE Trans. On Advan. Packag, vol.28, issue.2, 2005. ,
The Finite-Element method for moedling circuits and interconnects for electronic packaging, IEEE Trans. Micro. Theory and Techn, vol.45, issue.10, 1997. ,
Modeling of power supin large chips using the circuit-based finite difference time-domain method, IEEE Trans. Electromag. Comp, vol.47, pp.424-439, 2005. ,
Modeling of irregular shaped power distribution planes using transmission matrix method, IEEE Trans. On Advanced Packaging, vol.24, issue.3, pp.334-346, 2001. ,
Modeling and Analysis of Multichip module power supply planes, IEEE Trans, On Comp. Packag. And Manuf. Technology, vol.18, pp.628-639, 1995. ,
Modeling and measurement of inter level electromagnetic coupling and fringing effect in a hierarchical power distribution network using segmentation method with resonant cavity model, IEEE Trans. Adv. Packag, vol.31, issue.3, pp.544-557, 2008. ,
Analysis of Multiconductor Transmission Lines, 1994. ,
Progress in the methodologies for the electrical modeling of interconnects and electronic packages, Proc. of IEEE, vol.89, 2001. ,
Passive multipoint moment matching model order reduction algorithm on multi port distributed interconnect networks, IEEE Trans. Circuits Syst, vol.46, pp.140-160, 1999. ,
, Signal Integrity, 2010.
Power plane SPICE models and simulated performance for materials and geometries, IEEE Trans. On Advanced Packaging, vol.24, issue.3, pp.277-287, 2001. ,
Inductance calculations in c complex integrated circuit environment, IBM J. Res. Develop, vol.16, issue.5, pp.470-481, 1972. ,
Modeling electromagnetic interference properties of printed circuit boards, IBM J.Res Develop, vol.33, issue.1, pp.33-50, 1989. ,
Efficient method for predictive package Power/Ground planes modeling using Multi-Conductor Transmission Lines, Proc. of APEMC conf, pp.113-116, 2015. ,