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Article Dans Une Revue Advanced Powder Technology Année : 2020

Preparation and characterization of hollow silica nanocomposite functionalized with UV absorbable molybdenum cluster

Résumé

The nanoparticle-based material technology has recently opened a new heat shielding material generation for window applications such as aerogel, vacuum insulation panel or nanospace materials. Aiming to prepare a nanospace-based heat insulation material functionalized with an ultraviolet (UV) absorbent, the Mo-6 cluster-deposited hollow silica nanoparticles (HSNs) were prepared by the vacuum impregnation process (VIP). The pore channels of the hollow silica wall filled with the Cs-2[Mo6I8i(OCOC2F5)(6)(a)] octahedral cluster (CMIF) were confirmed by an HR-TEM coupled EDX device, ICP-OES and BET analysis. The retention of the octahedral structure or the typical optical property of the Mo-6 cluster in the pores of the HSNs was demonstrated by ultraviolet (UV) light absorption and photoluminescence spectroscopes even though the powders were heated to 200 degrees C. The multi-functional CMIF@HSNs nanocomposite could adsorb the UV rays under 400 nm and scatter the NIR light through the pores of the silica wall in order to reduce the heat passing a window. For this purpose, the film preparation based on the CMIF@HSNs nanocomposite was performed by dip coating in the commercially available top coat suspension (TCS) on soda lime glass. Excellent mechanical and optical properties of the CMIF@HSNs-based thin film were visibly obtained with a relative transmittance. This study suggests a potential insulation material prepared by a high efficiency and simple method for reducing the air temperature in buildings.

Domaines

Matériaux
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Dates et versions

hal-02531296 , version 1 (14-04-2020)

Identifiants

Citer

Thi Kim Ngan Nguyen, Fabien Grasset, Stéphane Cordier, Maria Amela-Cortes, Yoshio Matsui, et al.. Preparation and characterization of hollow silica nanocomposite functionalized with UV absorbable molybdenum cluster. Advanced Powder Technology, 2020, 31 (2), pp.895-903. ⟨10.1016/j.apt.2019.12.009⟩. ⟨hal-02531296⟩
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